Flexible foiled dielectrics: classification and analysis of ways for application and improvement

A. V. Vorobyev; V. D. Zhora

doi:10.15222/TKEA2014.2.56

A. V. Vorobyev Research and Production Company "Polycom" LLC, Krasnogorsk, Russia
V. D. Zhora SE "RI of Microdevices", STS "Institute for. Single crystals" NASU, Kyiv, Ukraine

DOI: https://doi.org/10.15222/TKEA2014.2.56

Keywords: flexible foiled insulators, lacquer-foil dielectrics, polyimide base, polyimide lacquer, metal foil

Abstract

The paper presents a classification of flexible foiled dielectrics of different types. A comparative analysis of the properties of dielectrics manufactured with the use of adhesives, as well as without them, is given. Methods for the preparation of flexible foiled non-adhesive dielectrics, materials of conductive layer and a dielectric base are considered. The technical characteristics of the various polymer films used as a dielectric base are given. The advantages of the polyimide films in comparison with other polymer films are shown.
The most perspective option of manufacturing of non-adhesive foiled dielectrics based on polyimide obtained by applying of a polyimide lacquer on metal foil, the so-called lacquer-foil dielectrics, is highlighted. The technology of manufacturing of lacquer-foil dielectrics with higher quality characteristics is described. The polyimide base of dielectrics has better adhesion to the foil and guaranteed uniformity of degree of imidization of 95–100%. The technology developed has allowed to carry out serial production of materials for electronic equipment. A series of lacquer-foil dielectrics of different thicknesses of foil is manufactured: aluminium — 10, 14, 20, 25 and 30 µm, nickel — 7 µm and copper — 18, 35, 50 µm. These materials are used for the manufacturing of flexible polyimide carriers, stubs, microcables, membranes of acoustic transducers and thermistors.

References

A. M. Medvedev. [Materials for flexible printed circuit boards]. Tekhnologii v elektronnoi promyshlennosti. 2011, no 3. (Rus)

http// www.gts-flexible.co.uk/

Gooskov G. Ya, Blinov G. A., Gazarov A. A. Montazh mikroelektronnoi apparatury [Installation of microelectronic devices]. Moscow. Radio and Communications, 1986.

Vazhenin I. N., Blinov G. A., Koledov L. A. Et al. Mikroelektronnaya apparatura na beskorpusnykh integral'nykh mikroskhemakh [Microelectronic devices on unpackaged integrated circuits]. Moscow. Radio i svyaz, 1985.

Dinev D. A., Zhora V. D., Grigoryeva N. N., Grunyanskaya V. P. [A technology for flexible thermoresistors on polyimide base]. Tekhnologiya i konstruirovanie v elektronnoi apparature. 2013, no 1, pp. 38-41. (Rus)

Baklayev K. K., Vorobyev A. V., Zhora V. D. [Low impedance acoustic membranes based on polyimide films]. Proceedings of the 14th International scientific-practical conference «Modern information and electronic technologies», Ukraine, Odessa. 2013, vol. II, pp. 248-250. (Rus).

Verbitskiy V. G., Plis N. I., Zhora V. D., Grunyanskaya V. P. [Comparative analysis of methods for the microcircuit assembly on flexible polyimide carriers]. Tekhnologiya i konstruirovanie v elektronnoi apparature. 2013, no 5, pp 37-41. (Rus)

http://www.cgstape.com/doc/film_cm.htm.

Russia patent 2240921 [A method for producing a polyimide material] V. N. Vorobyev, A. V. Vorobyev. 27.11.2004.

http://www.apogeeacoustic.com

Borshchov V.N., Listratenko O. M., Antonova V. A., Protsenko M. A., Tymchuk I.T., Kostyshyn Y. Y. [LED modules on the basis of aluminium« Chip on flex» (COF) technology] Svitlotekhnika ta elektroenergetika. 2008, no 4, pp. 31-37. (Rus)

Bessonov M. I., Koton M. M., Kudryavtsev V. V., Laius L. A. Poliimidy — klass termostoikikh polimerov [Polyimides — a class of heat-resistant polymers]. Leningrad, Nauka, 1983, 328 p.

USSR Copyright certificate 1781733. [A method for assembling integrated circuits] A. G. Sherevenya, I. A. Tuchinskii, V. D. Zhora. 1992. no 46.

Gavriushin N. [Methods of manufacturing of flexible printed circuit boards and cables] Zarubezhnaya radioelektronika. 1985, no 5, pp. 51-63. (Rus)

http://www.plastspb.ru/index.php/materialy/polietilenteraftalat-pet.

Borschev V. N., Antonova V. A., Listratenko A. M. et al. [An integrated approach to the choice of structural and technological solutions for flex-rigid one-detector modules for Compton medical imaging]. In book Stsintillyatsionnye materialy. Inzheneriya, ustroistva, primenenie. Khar'kov. ISMA, 2009, pp. 111-127. (Rus)