Influence of alloying additives on the heat resistance and heat transfer of nickel coatings of IC packages

  • S. P. Novosyadly Vasyl Stefanyk Precarpathian National University, Ivano-Frankivsk, Ukraine
  • R. M. Ivanyuk Vasyl Stefanyk Precarpathian National University, Ivano-Frankivsk, Ukraine
Keywords: electroplated alloy, heat resistance, package, coating, microhardness

Abstract

Using modern diagnostic microanalysis tools, the regularities of changes in the electrophysical parameters of Ni‑B electroplated coatings of IC packages during ultrasonic welding of internal Al leads and package sealing have been established. An optimal electrolyte composition has been selected, providing increased heat resistance of IC packages with alloyed nickel coatings, which, in combination with local gold plating, enables the mounting of chips through a eutectic Si‑Au sublayer.

Published
2008-04-30
How to Cite
Novosyadly, S. P., & Ivanyuk, R. M. (2008). Influence of alloying additives on the heat resistance and heat transfer of nickel coatings of IC packages. Technology and Design in Electronic Equipment, (2), 56-59. Retrieved from https://tkea.com.ua/index.php/journal/article/view/TKEA2008.2.56
Issue
No. 2 (2008): Tekhnologiya i konstruirovanie v elektronnoi apparature
Section
Articles

Copyright (c) 2008 Novosyadly S. P., Ivanyuk R. M.

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