CFD-simulation of radiator for air cooling of microprocessors in a limitided space
Abstract
One of the final stages of microprocessors development is heat test. This procedure is performed on a special stand, the main element of which is the switching PCB with one or more mounted microprocessor sockets, chipsets, interfaces, jumpers and other components which provide various modes of microprocessor operation.
The temperature of the microprocessor housing is typically changed using a thermoelectric module. The cold surface of the module with controlled temperature is in direct thermal contact with the microprocessor housing designed for cooler installation. On the hot surface of the module a radiator is mounted. The radiator dissipates the cumulative heat flow from both the microprocessor and the module.
High density PCB layout, the requirement of free access to the jumpers and interfaces, and the presence of numerous sensors limit the space for radiator mounting and require the use of an extremely compact radiator, especially in air cooling conditions. One of the possible solutions for this problem may reduce the area of the radiator heat-transfer surfaces due to a sharp growth of the heat transfer coefficient without increasing the air flow rate. To ensure a sharp growth of heat transfer coefficient on the heat-transfer surface one should make in the surface one or more dead-end cavities into which the impact air jets would flow.
CFD simulation of this type of radiator has been conducted. The heat-aerodynamic characteristics and design recommendations for removing heat from microprocessors in a limited space have been determined.
References
Spokoiny M., Trofimov V. Collider jets cooling method of microprocessors. Proc. of the 2011 International Microelectronics and Packaging Society ATW on Thermal Management, Session 12 “Liquid, phase-change and refrigeration cooling”. Palo Alto, CA, USA, November 7-9, 2011, pp. 1-18.
Spokoiny M., Trofimov V., Qiu Х., Kerner J.M. Enhanced heat transfer in a channel with combined structure of pins and dimples // Proc. of the 9th AIAA/ASME Joint Thermophysics and Heat Transfer Conference, San Francisco, CA, USA, 2006, pp. 1-21.
Bulavin L.A., Aktan O.Yu., Nikolaienko T.Yu., Nikolaienko Yu.E. [Experimental examination of a temperature field of a heat sink cooler]. Tekhnologiya i konstruirovanie v elektronnoi apparature. 2006. no 5, pp. 61-64. (Rus)
Pismenniy E. N., Rogachev V. A., Baranjuk A. V., Tcvyachenko E. V. [Thermal efficiency of with plate-cut fins in conditions low speed to blow]. Tekhnologiya i konstruirovanie v elektronnoi apparature. 2005, no 4, pp. 43-45 (Rus)
Rassamakin B. M., Rogachev V. A., Khayrnasov S. M. [Coolers based on heat pipes for thermally loaded devices of personal computers]. Tekhnologiya i konstruirovanie v elektronnoi apparature. 2006, no 4, pp. 48-50. (Rus)
Spokoiny Ju.E., Trofimov V.E., Olibash G.V. [The choice of constructional parameters of heat radiators for LSIC jet impact cooling]. Tekhnologiya i konstruirovanie v elektronnoi apparature. 1998, no 1, pp. 18-19. (Rus)
Spokoyny Ju.E., Trofimov V. E., Olibash G. V. [The designing of heat radiators for IC with jet impact air cooling]. Tekhnologiya i konstruirovanie v elektronnoi apparature. 1998, no 2, pp. 17-19. (Rus)
Berezuts`kii V.V. [Fundamentals of labor protection]. Kharkov, Fact, 2007, 241 p. (Rus)
Trofimov V. E., Pavlov A. L., Zhmud E. V. [Visualization of the interaction of a jet with a dead-end cavity of the radiator for liquid cooling of a microprocessor]. Proc. of the 16th International scientific-practical conference “Modern information and electronic technologies”, Ukraine, Odessa, 2015, pp. 160-161. (Rus)
Copyright (c) 2016 V. E. Trofimov, A. L. Pavlov, E. A. Mokrousova

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