The influence of the key limiting factors on the limitations of heat transfer in heat pipes with various working fluids
Abstract
Aluminium and copper heat pipes with grooved and metal fibrous capillary structure are high effective heat transfer devices. They are used in different cooling systems of electronic equipment like LED modules, microprocessors, receive-transmit modules and so on. However, thus heat pipes have heat transfer limitations. There are few types of these limitations: hydraulic limitation, boiling limitation, liquid entrainment by vapor flow and sonic limitation. There is necessity to know which one of these limitations is determinant for heat pipe due to design process. At a present article calculations of maximum heat transfer ability represented. All these calculations were made for LED cooling by using heat pipes with grooved and metal fibrous capillary structures. Pentane, acetone, isobutane and water were used as a coolant. It was shown that the main operation limit for axial grooved heat pipe, which determinate maximum heat transfer ability due to inclination angle for location of cooling zone higher than evaporation zone case, is entrainment limit for pentane and acetone coolants. Nevertheless, for isobutane coolant the main limitation is a boiling limit. However, for heat pipes with metal fibrous capillary structure the main limitation is a capillary limit. This limitation was a determinant for all calculated coolants: water, pentane and acetone. For high porosity range of capillary structure, capillary limit transfer to sonic limit for heat pipes with water, that means that the vapor velocity increases to sonic velocity and can't grow anymore. Due to this, coolant can't in a needed quantity infill condensation zone and the last one drained. For heat pipes with acetone and pentane, capillary limit transfer to boiling limit. All calculations were made for vapor temperature equal to 50°C, and for porosity range from 30% to 90%.
References
Ivanovskiy M.N., Sorokyn V.P., Iagodkin I.V. Fizicheskie osnovy teplovykh trub [Physical fundamentals of heat pipes]. Moscow, Atomizdat, 1978, 256 р. (Rus)
Gvozdev S. M., Mitrofanov A. V., Safonov S. A., Kholodilov V. I. [On the application of heat pipes in designing powerful lightning devices with LEDs]. Svetotekhnika, 2012, no 2, pp. 19-21 (Rus)
Hongyu Tang, Jia Zhaoi, Bo Li, Stanley Y Y Leungi, Cadmus C A Yuan, and G Q Zhang. Thermal Performance of Embedded Heat Pipe in High Power Density LED Streetlight Module. IEEE 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014, Ghent, Belgium, рр. 1/6-6/6. http://dx.doi.org/10.1109/EuroSimE.2014.6813883
Saprykin S., Smyrnov V., Abalov A. [Experience, son of difficult mistakes or why engineers needed due to creation of a lamp? Part 1, Redundant heat and how to struggle with it]. CHIP News Ukraine. Engineering microelectronics. 2016, no. 6, pp. 31-36 (Rus).
Nikolaienko Yu.E. [Schematics of the architecture of heat rejection from functional modules of a computer with the help of two-phase heat-transfer devices]. Upravlyayushchie Sistemy i Mashiny. 2005, no. 2, pp. 29-36 (Rus). http://ela.kpi.ua/handle/123456789/16362
Mohamed H. A. Elnaggar, Mohd. Zulkifly Abdullah, and Sri Raj Rajeswari Munusamy. Experimental and numerical studies of finned L-shape heat pipe for notebook-PC cooling. IEEE Transactions on Components, Packaging and Manufacturing Technology. June 2013, vol. 3, no. 6, pp. 978-988. http://dx.doi.org/10.1109/TCPMT.2013.2245944
Vasil’ev L. L. Jr., Grakovich L. P., Dragun L. A., Zhuravlev A. S. , Olekhnovich V. A. , Rabetskii M. I. System for Cooling of Electronic Components. Journal of Engineering Physics and Thermophysics, January 2017, vol. 90, iss. 1, pp. 95-101. http://dx.doi.org/10.1007/s10891-017-1543-8
Merzhvinskiy P.A., Osynskiy V.I., Nikolaenko Yu.E., Zhuk S.K. [Energetic fluxes in geterolasers and problems of heat sink]. Optyko-elektronny informatsiyno-energetychny technologii. 2002, no. 1, pp. 121-124 (Rus). http://ela.kpi. ua/handle/123456789/18017
Glazunova L.V. [Thermal stabilization system in receive–transmitting outfit]. Ingenerniy vesnyk Dona. 2010, vol. 20, no. 2, pp. 115-119 (Rus). http://ivdon.ru/uploads/article/pdf/2012_2_17.pdf_759.pdf
Masataka Mochizuki, Thang Nguyen, Koichi Mashiko, Yuji Saito, Tien Nguyen, Vijit Wuttijumnong. A review of heat pipe application including new opportunities. Frontiers in Heat Pipes (FHP). 2011, vol. 2, 013001, pp. 1-15. http://dx.doi.org/10.5098/fhp.v2.1.3001
Khairnasov S., Naumova A. Heat Pipes Application in Electronics Thermal Control Systems. Frontiers in Heat Pipes (FHP). 2015, vol. 6, iss. 6, pp. 1-14. http://dx.doi.org/10.5098/fhp.6.6.
Chi S. Teplovye truby: Teoriyа i praktika [Heat pipes: Theory and practice]. Moscow, Mashynostroenie, 1981, 207 р. (Rus)
Nikolaenko T.Yu., Nikolaenko Yu.E. New circuit solutions for the thermal design of chandeliers with Light Emitting Diodes. Light & Engineering. 2015, vol. 23, no. 3, pp. 85-88. http://www.scopus.com/inward/record.url?eid=2-s2.0-84966507707&partnerID=MN8TOARS
Pat. 81688 Ukraine. [LED lighting unit]. Yu. E. Nikolaenko, B. M., Rassamakin, S. M. Khairnasov. 2014, byul. no 13 (Ukr).
Nikolaenko Yu. E., Bykov E. V., Lozoviy M. A., Khairnasov. S. M., Khmelev Yu. A. [The ways of Reducing the Temperature of LED Chip as part of Chandeliers with aluminum heat pipe]. Proc. of 15th International scientificpractical conf. “Modern information and electronic technologies”, Vol. II. Ukraine, Odessa, 2014, pp. 24-25 (Rus). http://ela.kpi.ua/handle/123456789/17475
Kozak D. V., Nikolaenko Yu. E. The working characteristics of two-phase heat transfer deviсes for LED modules. 2016 IEEE International Conference on Electronics and Information Technology (EIT’16). Conference Proceeding. Ukraine, Odessa, 2016, рр. 1-4. http://dx.doi.org/10.1109/ICEAIT.2016.7500980
Lozoviy M. A., Nikolaenko Yu. E., Rassamakin B. M., Khairnasov. S. M. [Research on thermal characteristics of heat pipes for LED lightening devices]. Tekhnologiya i konstruirovanie v elektronnoy apparature, 2014, no 5-6, pp. 32-38 (Rus). http://dx.doi.org/10.15222/TKEA2014.2.32
Kravets V.Yu., Nikolaenko Yu.E., Nekrashevich Ya.V. Experimental studies of heat-transfer characteristics of miniaturized heat pipes. Heat Transfer Research, 2007, vol. 38, no. 6, pp. 553-563. http://dx.doi.org/10.1615/HeatTransRes.v38.i6.70
Nikolaenko Yu. E., Rotner S. M. Using laser radiation for the formation of capillary structure in flat ceramic heat pipes. Technical Physics Letters, 2012, vol. 38, iss. 12, pp. 1056-1058. http://dx.doi.org/10.1134/S1063785012120085
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