Application of the technology of thin films and nanostructured materials in the manufacture of thermally loaded printed circuit boards

  • E. A. Sakhno Central Research Technological Institute “Technomash”, Moscow, Russia
  • M. A. Balashov Central Research Technological Institute “Technomash”, Moscow, Russia
  • V. V. Zhilikov Central Research Technological Institute “Technomash”, Moscow, Russia
  • D. V. Lobasov Central Research Technological Institute “Technomash”, Moscow, Russia
Keywords: printed circuit board, metal base, thermal conductivity, aluminum nitride

Abstract

The expediency is shown for application of aluminium nitride thin films, which has unique physical and chemical properties, for high heat resistance of the circuit board. There was described the technology of printed circuit board with resistors, located in the vias, based on the use of a metal base coated with aluminium nitride.

Published
2011-10-17
How to Cite
Sakhno, E. A., Balashov, M. A., Zhilikov, V. V., & Lobasov, D. V. (2011). Application of the technology of thin films and nanostructured materials in the manufacture of thermally loaded printed circuit boards. Technology and Design in Electronic Equipment, (5), 3-5. Retrieved from https://tkea.com.ua/index.php/journal/article/view/TKEA2011.5.03
Issue
No. 5 (2011): Tekhnologiya i konstruirovanie v elektronnoi apparature
Section
Articles

Copyright (c) 2011 Sakhno E. A., Balashov M. A. Zhilikov V. V., Lobasov D. V.

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This work is licensed under a Creative Commons Attribution 4.0 International License.