Multi-chip modules on an anodized aluminum substrate

  • V. A. Sokol Belarusian State University of Informatics and Radioelectronics, Minsk, Belarus
  • A. I. Vorobyova Belarusian State University of Informatics and Radioelectronics, Minsk, Belarus
Keywords: multi-chip modules, aluminum substrate, anodic aluminum oxide, local anodization, protective mask, electrochemical processes, heat-dissipating pillars

Abstract

The results of investigations into the process of local formation of porous anodic aluminum oxide and its alloys are presented. A technological process for forming a protective mask stable during thick-layer electrochemical anodization of aluminum alloys in the process of manufacturing an aluminum substrate with heat-dissipating pillars and contact junctions has been developed.

Published
2002-04-30
How to Cite
Sokol, V. A., & Vorobyova, A. I. (2002). Multi-chip modules on an anodized aluminum substrate. Technology and Design in Electronic Equipment, (2), 40-45. Retrieved from https://tkea.com.ua/index.php/journal/article/view/TKEA2002.2.40
Issue
No. 2 (2002): Tekhnologiya i konstruirovanie v elektronnoi apparature
Section
Articles

Copyright (c) 2002 Sokol V. A., Vorobyova A. I.

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