Diode reactor systems for microetching

  • V. I. Farenik National Science Center «Kharkiv Institute of Physics and Technology», NAS of Ukraine, Ukraine
Keywords: diode reactors, microetching systems, capacitive discharge, plasma equipment, low-energy consumption, combined fields

Abstract

The development of low-energy-consumption plasma technological equipment based on discharges with combined constant and alternating electric and magnetic fields is carried out. This paper presents the results of investigations on the characteristics of high-frequency capacitive discharges and the development of diode reactors for low-energy-input microetching systems.
Published
2002-06-30
How to Cite
Farenik, V. I. (2002). Diode reactor systems for microetching. Technology and Design in Electronic Equipment, (3), 38-42. Retrieved from https://tkea.com.ua/index.php/journal/article/view/TKEA2002.3.38
Issue
No. 3 (2002): Tekhnologiya i konstruirovanie v elektronnoi apparature
Section
Articles

Copyright (c) 2002 Farenik V. I.

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