Influence of polycrystalline silicon layer on flow through «metal — p-Si» contact

  • V. A. Smyntyna I. I. Mechnikov Odesa National University, Odesа, Ukraine
  • О. А. Kulinich I. I. Mechnikov Odesa National University, Odesа, Ukraine
  • I. R. Yatsunskii I. I. Mechnikov Odesa National University, Odesа, Ukraine
  • O. V. Sviridova I. I. Mechnikov Odesa National University, Odesа, Ukraine
  • I. A. Marchuk I. I. Mechnikov Odesa National University, Odesа, Ukraine
Keywords: polycrystalline silicon, current transport, metal — p-Si contact

Abstract

Based on the results of investigations of charge transport in the "metal — p-Si" contacts with different thickness of polycrystalline p-Si layer the mechanisms of charge transport through such structures are shown. It is established that with increasing thickness of the layer of polycrystalline p-Si current transport mechanism changes from a double injection into the drift-diffusion. This change is due to an increase in the drift current component in the space charge zone of "metal — p-Si" contact, which arises as a result of increased surface density of scattering barriers, which are localized at the boundaries of neighboring silicon polycrystals.

Published
2011-10-17
How to Cite
Smyntyna, V. A., KulinichО. А., Yatsunskii, I. R., Sviridova, O. V., & Marchuk, I. A. (2011). Influence of polycrystalline silicon layer on flow through «metal — p-Si» contact. Technology and Design in Electronic Equipment, (5), 39-41. Retrieved from https://tkea.com.ua/index.php/journal/article/view/TKEA2011.5.39