Contact connections in electronic printing circuit, performed using the foil puncture method

Abstract

The results of theoretical and experimental researches of the unsoldered contact connections performed using the foil puncture method are demonstrated. The structural parameters of printing circuit boards and contacts of electronic components from positions of microminiatu-rization of electronic apparatus are determined. Contact connections were tested for resistance to a number of climatic and mechanical factors, and the strength characteristics of the terminals were measured to ensure their press-fit connection.