CFD-modeling of the temperature field of the radiator casing of the transmitting module of the active phased antenna arrays with air cooling

Keywords: CFD-modeling, output power amplifier, radiator, air cooling, temperature field

Abstract

Frequency multipliers are used in electronic devices to generate spectrally pure sinusoidal signals in the frequency range from a few to tens of GHz. The multipliers are used to multiply the frequency of highly stable but more low-frequency devices with the subsequent extraction of the necessary harmonics from the frequency spectrum of the received microwave range. The frequencies selected after multiplication (set) have significantly higher energy, spectral and range characteristics, which allows them to be used as local oscillators and synthesizers in receiving and transmitting systems.
The authors of this paper theoretically substantiate and practically demonstrate the possibility of an unconventional implementation of a microstrip multiplier of the microwave range based on a directional traveling wave filter. The proposed implementation does not require the use of active semiconductor elements.
The well-known circuit and technological principles for the creation of microstrip microwave multipliers are considered in the paper. The features, problems and shortcomings arising from their implementation are analyzed. The effectiveness of using the balanced circuit for frequency multiplication is confirmed. A list of mandatory requirements and conditions necessary for the implementation of the microwave multipliers is given. It is demonstrated that the features of the microstrip travelling-wave filter are identical to the conditions and requirements for the implementation of balanced multipliers. It is shown and substantiated how an unconventional implementation of a passive microwave multiplier is possible due to the electromagnetic interaction of the input and output nodes of such a filter with an annular travelling-wave resonator. Using the example of modifying a block diagram of a directional filter into a multiplier circuit, the possibility of creating a microwave doubler is confirmed by separating a given frequency from the frequency spectrum of a traveling-wave ring resonator.

References

Radar technology advancements and new applications (Pasternack Enterprises, Inc., Irvine, Calif.). Microwave Journal, 2017, vol. 60, iss. 3, pp. 82-96. https://www.pasternack.com/t-Radar-Technology-Advancements-and-New-Applications.aspx

Rathod Somsing, Sreenivasulu K., Beenamole K. S., Ray K. P. Evolutionary trends in transmit/receive module for active phased array radars. Defence Science Journal, 2018, vol. 68, no. 6, pp. 553-559. https://doi.org/10.14429/dsj.68.12628

Borisov O. V., Zubkov A. M., Ivanov K. A., Minnebayev V. M., Red’ka Al. V. [Broadband 70-Watt GaN X-Band Power Amplifier]. Elektronnaya tekhnika. Seriya 2. Poluprovodnikovyye pribory, 2014, iss. 2 (233), pp. 4-9. (Rus)

Battaglia B. D., Burger J., Titizian J. [The evolution of S-band radar technology: reducing the total cost by increas-ing the degree of integration. Integra Technologies Example]. Komponenty i Tekhnologii, 2009, no 12, pp. 56-60. (Rus)

Colotun O. [Advanced technologies for the production of microwave transistors by the company Integra Technologies, Inc. for radar systems]. CHIP NEWS Ukraine, 2010, no. 8 (98), pp. 8-16. (Rus)

Kuliev M.V. [Overview of today’s GaN transistors and development trends]. Elektronnaya tekhnika. Seriya 2. Poluprovodnikovyye pribory. Vypusk 2 (245) 2017, pp. 18-28. (Rus)

Krakhin O. I., Radchenko V. P. [The heat removing of send-receive modules (SRM) and APAA (active phased array antenna) with a high level of thermal radiation]. III all-Rus-sian conference “Radar and radio” – IRE RAS, 2009, pð. 716-719. (Rus). http://jre.cplire.ru/jre/library/3conference/pdffiles/s007.pdf

Sergeyev V. A., Tarasov R. G., Kulikov A. A. Khodakov A. M. [Simulation and study of the thermal modes of the output amplifiers of the microwave receiver-transmitting mod-ules for AFAR ]. Proc. of the 50-y Scientific and Technical Conference “Vuzovskaya nauka v sovremennykh usloviyakh”. Part 2, Russia, Ul’yanovsk, UlGTU, 2016, pp. 37-40. (Rus)

Timoshenkov V., Khlybov A., Rodionov D., Efimov A., Chapligin Yu. [Thermo researching of X-band micro-wave amplifier]. VIII All-Russian Scientific and Technical Conference “Problems of development of promising micro-and nanoelectronic systems” (MES-2018), Russia, Moscow, 2018, iss. 3, pp. 98-102. (Rus). https://doi.org/10.31114/2078-7707-2018-3-98-102

Trofimov V. Ye., A. L. Pavlov. [Intensification of heat transfer in liquid heat exchangers with dimple-pin finning]. Tekhnologiya i Konstruirovanie v Elektronnoi Apparature, 2016, no. 1, pp. 23-26. (Rus) https://doi.org/10.15222/TKEA2016.1.23

Trofimov V. Е., Pavlov A. L., Mokrousova E. A. CFD-simulation of radiator for air cooling of microproces-sors in a limitided space. Tekhnologiya i Konstruirovanie v Elektronnoi Apparature. 2016, no. 6, pp. 30-35. (Rus) https://doi.org/10.15222/TKEA2016.6.30

Trofimov V. Е., Pavlov A. L., Storozhuk A. S. [CFD- simulation of impact jet radiator for thermal testing of mi-croprocessors]. Tekhnologiya i Konstruirovanie v Elektronnoi Apparature. 2018, no. 5-6, pp. 30-36. (Rus) https://doi.org/10.15222/TKEA2018.5-6.30

Baranyuk A.V., Nikolaenko Yu.E. [CFD-modeling of thermal-hydraulic characteristics of developed surfaces with mini-channels]. Molodiy Vcheniy, no. 12 (64), pp. 224–228, (Rus). https://doi.org/10.1016/j.tsep.2019.03.018

Baranyuk A.V., Nikolaenko Yu.E., Rohachev V.A., Terekh O.M., Krukovsky P.G. Investigation of the flow structure and heat transfer intensity of surfaces with split plate finning. Thermal Science and Engineering Progress, 2019, no. 11, pp. 28-39. https://doi.org/10.1016/j.tsep.2019.03.018

Drak O.T., Zhigalov V.G., Zadorozhny A.I., Parnes M.D. [Experience in solving the problem of heat removal from the transmitting module AFAR]. Collection of articles of the IV All-Russian Conference “Electronics and Microelectronics Microwave”, Russia, St. Petersburg, 2015, vol. 1, pp. 292-295. (Rus)

Scott M. (2003) SAMPSON MFR active phased array antenna. IEEE International Symposium on Phased Array Systems and Technology, 2003, pp. 119-123. https://doi.org/10.1109/past.2003.1256967

Savenko V.A. [Unification of design solutions for the construction of receiving and transmitting modules APAA of various ranges]. Proc. of All-Russian Conference “Electronics and Microelectronics Microwave”, St. Petersburg, 2013, 5 p. (Rus). www.mwelectronics.ru/2013/Oral/5/05_Doclad_Savenko-izmenenny%60i%60.pdf

Woosang Lee, Joonho So, Junyeon Kim, Byungil Woo, Won Jang, Gyeik Jun, Sungjong Lee. Design of T/R module for the wideband active array antenna. IEEE Antennas and Propagation Society International Symposium, 2006, USA, NM, Albuquerque. https://doi.org/10.1109/aps.2006.1710665

Youngchan Yoon, Seung-Jae Park, Dong Rip Kim, Kwan-Soo Lee. Thermal performance improvement based on the partial heating position of a heat sink. International Journal of Heat and Mass Transfer, 2018, vol. 124, pp. 752-760. https://doi.org/10.1016/j.ijheatmasstrans-fer.2018.03.080

Luke Maguire, Masud Behnia, Graham Morrison. Numerical evaluation of high power amplifier heat sink design options. Proc. of IPACK03 International Electronic Packaging Technical Conference and Exhibition, 2003, USA, Hawaii, Maui, paper no. IPACK2003-35077, pp. 171-181. https://doi.org/10.1115/IPACK2003-35077

Reay D.A., Kew P.A., McGlen R.J. Heat pipe: theory, design and applications. Amsterdam, Buterworth-Heinemann, 2014.

Published
2019-04-29