Synthesising solver structure of the OpenFOAM mathematical modeling system for analysing thermal mode of LED lamps
Abstract
Today LED lamps are used more and more widely in various fields of human activity. The operation of LEDs substantially depends on the thermal dissipation power and temperature. In this regard, one of the mandatory stages in the process of creating such lamps is the analysis of their thermal mode, which is necessary for the development of a heat sink.
In order to analyze the thermal mode and design the heat sink for powerful LED lamps, the authors synthesized the structure of the problem solver. The new structure was based on the structure of the basic laplacianFoam solver and the application of the swak4foam library functions, which is a part of the OpenFOAM computational fluid dynamics toolbox. The results of the thermal mode simulation of the LED thermal model (a plate with a rectangular heat source) obtained using a modified solver were compared with those obtained by the proprietary solver of the CAD/CAE SolidWorks system and those obtained by analytical computation. The data adequacy of the modified solver was estimated and its practical application verified.
The thermal mode of the Samsung LC009D LED, which is placed on the flat-plate finned heat sink, was analyzed. The Kaufer 5204 glue ability to be used in such design with natural convection cooling of the heat sink was tested. The glue thickness was 0.1 mm and its thermal conductivity was 1,5 W/(m·K). The heat sink's heat transfer coefficient was 10 W/(m2·K). The paper presents corresponding temperature distributions and shows that the new technique can be used for solving problems that arise when designing LED lamps.
References
Markova S., Turkin A. [Current applications of high-power LEDs]. Solid-State Lighting Magazine, 2016, no.3, pp. 56–62. https://www.prosoft.ru/cms/f/468322.pdf (Rus)
Yurtseven M.B., Mete S., Onaygil S. The effects of temperature and driving current on the key parameters of commercially available, high-power, white LEDs. Lighting Res. Technol., 2015, vol. 48, no. 8, pp. 943-965. https://doi.org/10.1177/1477153515576785
Schutt Ekaterina. Thermal management and design optimization for a high power LED work light. Degree Thesis. ARCADA, Plastics Technology, 2014, pp. 1-72. https://www.theseus.fi/bitstream/handle/10024/80460/Schutt_Ekaterina.pdf
LED Thermal Management. LED professional Review. 2009, iss. 13, pp. 1-64. https://www.led-professional.com/downloads/LpR_13_468932.pdf
Thermal Management of Cree XLamp LEDs. Application Note. Cree, Inc., 2019, 19 p. https://www.cree.com/led-components/media/documents/XLampThermalManagement.pdf
Rait M. [LEDs in CSP packages for solid state lighting systems]. CHIP NEWS Ukraine, 2016, no. 6 (156), pp. 38-40. http://www.lightingmedia.ru/netcat_files/File/20(2).pdf (Rus)
Yusupov S. [LEDIL optics for modules with Flip-Chip LEDs]. Sovremennaya Svetotekhnika, 2015, no. 6, pp. 24-25. http://www.lightingmedia.ru/netcat_files/File/24(1).pdf (Rus)
Ying S. P., Shen W. B. Thermal analysis of high-power multichip COB light-emitting diodes with different chip sizes. IEEE Trans. Electron Devices, 2015, vol. 62, no. 3, pp. 896-901. https://doi.org/10.1109/TED.2015.2390255
Schneider M., Leyrer B., Herbold C., Maikowske S. High power density LED modules with silver sintering die attach on aluminum nitride substrates. 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, pp. 203-208. https://doi.org/10.1109/ECTC.2014.6897289
Wu Y., Tang Y., Li Z., Ding X., Yuan W., Zhao X., Yu B. Experimental investigation of a PCM-HP heat sink on its thermal performance and antithermal-shock capacity for high-power LEDs. Appl. Therm. Eng., 2016, vol. 108, pp. 192-203. https://doi.org/10.1016/j.applthermaleng.2016.07.127
Nikolaenko Yu.E., Kravets V.Yu., Naumova A.N. Baranyuk A.V. Development of the ways to increase the lighting energy efficiency of living space. International Journal of Energy for a Clean Environment, 2017, vol.18, iss. 3, pp. 275-285. https://doi.org/10.1615/InterJEnerCleanEnv.2018021641
Nikolaenko Yu.E., Pekur D.V., Sorokin V.M. Light characteristics of high-power LED luminaire with a cooling system based on heat pipe. Semiconductor Physics, Quantum Electronics & Optoelectronics, 2019, vol. 22, no. 3, pp. 366-371. https://doi.org/10.15407/spqeo22.03.366
Lozovoi M. A., Nikolaenko Yu. E., Rassamakin B.M., Khairnasov C. M. [Research on thermal characteristics of heat pipes for LED lightning devices]. Tekhnologiya i Konstruirovanie v Elektronnoi Apparature, 2014, no. 5-6, pp. 32-38. https://doi.org/10.15222/TKEA2014.2.32 (Rus)
Sobyanin I.V. [Solving the problem of determining the temperature field of a plate with a heat source in the OpenFOAM mathematical modeling system with the laplacianfoam solver]. 23rd International Youth Forum "Radioelectronics and Youth in the XXI century". Vol. 2. Kharkiv National University of Radio Electronics, 2019, pp. 5-6. https://nure.ua/wp-content/uploads/workshop/konferentsiia-avtomatyzovani-systemy-ta-kompiuteryzovani-tekhnolohii-radioelektronnoho-pryladobuduvannia-.pdf (Rus)
ANSYS Multiphysics. Thermal management [Electronic resource]. https://www.ansys.com/products/platform/multiphysics-simulation/thermal-management (Date of the application 14.11.2019).
SOLIDWORKS Flow Simulation. Heat conduction in solids [Electronic resource]. https://www.solidworks.com/product/solidworks-flow-simulation (Date of the application 14.11.2019).
ELMER. Application examples [Electronic resource]. https://www.csc.fi/web/elmer/application-examples (Date of the application 14.11.2019).
COMSOL Heat Transfer Module [Electronic resource]. https://www.comsol.com/heat-transfer-module (Date of the application 14.11.2019).
OpenFOAM. The open source CFD toolbox [Electronic resource]. http://www.openfoam.com (Date of the application 14.11.2019).
Shekhovtsova V.I. [Selection problem and evaluation criteria for computer aided design] Visnyk NTU "KHPI", 2014, no. 26 (1069), pp. 101-108. http://repository.kpi.kharkov.ua/bitstream/KhPI-Press/9299/1/vestnik_HPI_2014_26_Shekhovtsova_Problema.pdf (Ukr)
Trofimov V. E., Pavlov A. L., Mamykin Y. G. CAD/CAE method of solving the hydrodynamic problem while developing powerful electronic devices. Tekhnologiya i Konstruirovanie v Elektronnoi Apparature, 2018, no. 2, pp. 33-41. http://dx.doi.org/10.15222/TKEA2018.2.33
OpenFOAM. The open source CFD toolbox laplacianFoam [Electronic resource]. https://www.openfoam.com/documentation/guides/latest/doc/guide-applications-solvers-basic-laplacianFoam.html (Date of the application 14.11.2019).
OpenFOAM. The open source CFD toolbox chtMultiRegionFoam [Electronic resource]. https://www.openfoam.com/documentation/guides/latest/doc/guide-applications-solvers-heat-transfer-chtMultiRegionFoam.html (Date of the application 14.11.2019).
Lazarev T.V. [Thermoelectric state simulation using OpenFOAM]. Bulletin of NTUU "Igor Sikorsky Kyiv Polytechnic Institute", Series "Chemical engineering, ecology and resource saving", 2013, no. 1, pp. 26-30. (Ukr)
M. de Groot. Flow prediction in brain aneurysms using OpenFOAM. September 2, 2014 [Electronic resource]. https://www.utwente.nl/en/eemcs/sacs/teaching/Thesis/masterthesis_meindert_de_groot.pdf (Date of the application 14.11.2019).
Juan Marcelo Gimenez, Axel Larreteguy, Santiago M'arquez Dami'an, Norberto Nigro. Short course on OpenFOAM development. ENIEF 2014. Instituto Balseiro, Bariloche, Argentina, September 2014 [Electronic resource]. https://cimec.org.ar/foswiki/pub/Main/Cimec/CursoCFD/OF_Developers_Course.pdf (Date of the application 14.11.2019).
Bernhard F.W. Gschaider. README for swak4Foam [Electronic resource]. https://openfoamwiki.net/images/e/e6/Swak4Foam_README.pdf (Date of the application 14.11.2019).
Dulnev G.N., Semyashkin E.M. Teploobmen v radioelektronnykh apparatakh [Heat transfer in electronic devices]. Leningrad, Energiya 1968, 360 p. (Rus)
High Voltage LED Series Chip on Board. LC009D-Gen.2. Product Family Data Sheet Rev.1.8, 2017.08.14, 15 p. https://4donline.ihs.com/images/VipMasterIC/IC/SAMS/SAMS-S-A0003497324/SAMS-S-A0003497324-1.pdf
Copyright (c) 2019 Sobianin I. V., Trofimov V. E.
This work is licensed under a Creative Commons Attribution 4.0 International License.
