No. 3 (2018): Technology and design in electronic equipment

Articles

• Sealing by soldering of microblock packages made of diamagnetic alloys using high-frequency heating

  V. L. Lanin, Yu. N. Grishchenko

  3-8

  • PDF (Українська)
• Information and measuring system on the basis of strain sensors based on silicon microcrystals

  A. O. Druzhinin, O. P. Kutrakov, S. I. Nichkalo, V. M. Stasiv

  9-14

  • PDF (Українська)
• Device-technological simulation of the magnetosensitive sensor with integrated magnetic concentrator

  V. R. Stempitsky, Dinh Ha Dao

  15-21

  • PDF (Українська)
• Frequency multipliers on semiconductor diode structures

  M. F. Karushkin

  22-37

  • PDF (Українська)
• Improved method of evaluating power losses in pulse converters of micro resistance welding machines

  O. F. Bondarenko, T. O. Ryzhakova, Yu. V. Kozhushko

  38-42

  • PDF (Українська)
• Scintillation materials based on solid solutions ZnSxSe1–x

  O. G. Trubaeva, M. A. Chaika, S. M. Galkin, A. I. Lalayants, T. A. Nepokupna

  43-49

  • PDF (Українська)