Microassembly on silicon board for accelerometer

  • V. G. Spirin Arzamas Polytechnic Institute (branch) of the NSTU, Russia
Keywords: multilevel circuit board, thin-film micromodule

Abstract

The paper presents microassembly design and technology for accelerometer, carried out on a silicon plate with three commutation levels and thin film resistors on both of its surfaces.

Published
2013-10-14
How to Cite
Spirin, V. G. (2013). Microassembly on silicon board for accelerometer. Technology and Design in Electronic Equipment, (5), 24-27. Retrieved from https://tkea.com.ua/index.php/journal/article/view/TKEA2023.5.24
Issue
No. 5 (2013): Tekhnologiya i konstruirovanie v elektronnoi apparature
Section
Articles

Copyright (c) 2013 Spirin V. G.

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